 The Thermacore Liquid Cooling System (LCS) is a sealed system that utilises pumped single phase liquid to cool computer microprocessors. The liquid cooling system uses a pump to circulate a thermally conductive liquid that removes heat from the processor using Thermacore’s Liquid Cold Plate technology and rejects it to the ambient air flowing through a liquid-to-air heat exchanger.
Thermacore has incorporated its patented sintered powder metal technology into the cold plate component. Microchannel cold plates can be used for applications with lower performance requirements. The all-aluminum, liquid-to-air heat exchanger allows for higher heat flux capability to maximize heat transfer efficiency by dissipating excess microprocessor heat into the local ambient air. | 
Thermacore’s Custom Embedded Tube-in-Plate Liquid Cold Plate technology is engineered to match the thermal/mechanical performance, pressure drop, and dimensional requirements of the application. These Embedded Tube-in-Plate cold plates consist of copper or stainless steel tubes pressed into a channeled aluminum or copper extrusion or machined plate. These cold plates are cost-effective and offer good heat removal for low-to-medium watt densities. Typical applications include power electronics, RF generators and transmitters, semiconductor processing equipment, and uninterruptible power supplies. 
Thermacore’s Vacuum-Brazed Cold Plate technology is engineered to match the thermal/mechanical performance, pressure drop, and dimensional requirements of the application. Thermacore customizes the internal flow configuration to maximize thermal performance and minimize cold plate pressure drop. The cold plates can include embedded heat pipes and can be manufactured in various sizes and shapes. Thermacore’s vacuum-brazed cold plates can include unique surface finish requirements and hole locations for mounting. Thermacore has designed these cold plates for various fluids including air, water, water/glycol and PAO. 